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Last Time Buy Date
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The last day that an order can be placed with the manufacturer to purchase a component before it becomes obsolete. |
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Last Time Ship Date
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The last day that a part was shipped by the manufacturer prior to obsolescence. |
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Latent Defect
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A physical defect inherent in the process architecture, design, or layout, or created during manufacturing (wafer fabrication or assembly) that is manifested after some period of operation. |
| Source: JEDEC website referencing JEP143B.01, 6/08 |
Lead Coplanarity
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Is defined as the vertical lead position with respect to a reference plane measured after forming. The reference plane is defined by the three lowest leads from the bottom of the package. |
| Source: Semiconductor Equipment and Materials International, SEMI® International Standards: Compilation of Terms (Updated 1108). |
Leader
Trailer
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The blank pockets at the beginning and ending of component carrier tape. |
| Source: IDEA Standard IDEA-STD-1010-B Acceptability of Electronic Components Distributed in the Open Market, Rev. B |
Leadframe
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A metal structure to which a die is attached. Wire bonds then connect the die to the leads. This is then encapsulated, usually in plastic but can be metal or ceramic, to cover and complete the device. |
| Source: IDEA Standard IDEA-STD-1010-B Acceptability of Electronic Components Distributed in the Open Market, Rev. B |
Life Cycle
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The entire life of an item of equipment, from conceptual design through to disposal. |
| Source: Semiconductor Equipment and Materials International, SEMI® International Standards: Compilation of Terms (Updated 1108). |